2017

1. Chen, R., Ramachandran, A., Liu, C., Chang, F., Senesky, D. G., “Tsai-Wu Analysis of a Thin-Walled 3D-Printed Polylactic Acid (PLA) Structural Bracket,” The 58th AIAA/ASCE/ASC Structures, Structural Dynamics, and Materials Conference, Grapevine, TX, 2017. [PDF]

2. Hou, M., So, H., Suria, A.J., Yalamarthy, A.S. and Senesky, D.G., "Suppression of Persistent Photoconductivity in AlGaN/GaN Ultraviolet Photodetectors Using In-situ Heating," IEEE Electron Device Letters, vol.38, no.1, pp.56-59, 2017. [PDF]

2016

1. Dowling, K.M., Ransom, E.R., and Senesky, D.G., "Profile Evolution of High Aspect Ratio Silicon Carbide Trenches by Inductive Coupled Plasma Etching," IEEE Journal of Microelectromechanical Systems, vol. PP, no. 99, p.1-8, 2016. [PDF]

2. Suria, A.J., Yalamarthy, A.S., So, H, and Senesky, D.G., "DC Characteristics of ALD-Grown Al2O3/AlGaN/GaN MIS-HEMTs and HEMTs at 600 °C in Air," Semiconductor Science and Technology, vol. 31, no. 11, 115017, 2016. [PDF]

3. Miller, R. A., So, H., Chiamori, H. C., Suria, A., Chapin, C. A., and Senesky, D. G., "A Microfabricated Sun Sensor Using GaN-on-Sapphire Ultraviolet Photodetector Arrays," Review of Scientific Instruments, vol. 87, no. 9, 095003, 2016. [PDF]

4. Miller, R. A., Chapin, C., Dowling, K., Chen, R., Suria, A., and Senesksy, D. G., "Low-Temperature Operation of Gallium Nitride Based Ultraviolet Photodetectors," AIAA SPACE 2016, SPACE Conferences and Exposition, AIAA 2016-5497. [PDF]

5. So, H and Senesky, D.G., "Rapid Fabrication and Packaging of AlGaN/GaN High-Temperature Ultraviolet Photodetectors Using Direct Wire Bonding," Journal of Physics D: Applied Physics, vol. 49, no. 28, 285109, 2016. [PDF]

6. Hou, M., Suria, A.J., Yalamarthy, A.S., So, H. and Senesky, D.G., "2DEG-Heated AlGaN/GaN Micro-Hotplates for High-Temperature Chemical Sensing Microsystems," Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, 2016. [PDF]

7. So, H., Lim, J., and Senesky, D.G., "Continuous V-Grooved AlGaN/GaN Surfaces for High-Temperature Ultraviolet Photodetectors," IEEE Sensors Journal, vol. 16, no. 10, pp. 3633-3639, 2016. [PDF]

8. So, H., Hou, M., Jain, S. R., Lim, J., and Senesky, D.G., "Interdigitated Pt-GaN Schottky Interfaces for High-Temperature Soot-Particulate Sensing," Applied Surface Science, vol. 368, pp.104-109, 2016. [PDF]

9. Yalamarthy, A.S., and Senesky, D.G., "Strain- and Temperature-Induced Effects in AlGaN/GaN High Electron Mobility Transistors," Semiconductor Science and Technology, vol. 31, no. 3, 035024, 2016. [PDF]

10. So, H. and Senesky, D.G., "Low-Resistance Gateless High Electron Mobility Transistors Using Three-Dimensional Inverted Pyramidal AlGaN/GaN Surfaces," Applied Physics Letters, vol. 108, no. 1, 012104, 2016. [PDF]

11. Xu, X., Zhong, J., So, H., Norvilas, A., Sommerhalter, C., Senesky, D.G. and Tang, M., "Wafer-Level MOCVD Growth of AlGaN/GaN-on-Si HEMT Structures with Ultra-High Romm Temperature 2DEG Mobility," AIP Advances, vol. 6, pp. 115016, 2016. [PDF]

2015

1. Dowling, K.M., Suria, A.J., Shankar, A., Chapin, C.A., and Senesky, D.G. "Multilayer Etch Masks for 3-Dimensional Fabrication of Robust Silicon Carbide Microsctructures", in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Estoril, Portugal, pp.284-287, 2015. [PDF]

2. Dowling, K.M., Suria, A.J., Won, Y., Shankar, A., Lee, H., Asheghi, M., Goodson, K.E., Senesky, D.G., "Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling", in Proc. of ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACKICNMM2015, San Francisco, California, USA, pp. 48409:1-7, 2015.

3. Suria, A. J., Chiamori, H. C., Shankar A. and Senesky, D. G., “Capacitance-voltage characteristics of gamma irradiated Al2O3, HfO2, and SiO2 thin films grown by plasma-enhanced atomic layer deposition”, in Proc. SPIE 9491, Sensors for Extreme Harsh Environments II, 949105, 2015. [PDF]

4. Chiamori, H.C., Miller, R., Suria, A., Broad, N. and Senesky, D.G. "Irradiation Effects on Graphene-Enhanced Gallium Nitride (GaN) Metal-Semiconductor-Metal (MSM) Ultraviolet Photodetectors", in Proc. SPIE 9491, Sensors for Extreme Harsh Environments II, 949107, 2015.

2014

1. Hou, M. and Senesky, D.G., "Operation of ohmic Ti/Al/Pt/Au multilayer contacts to GaN at 600 °C in air," Applied Physics Letters, vol. 105, no. 8, 081905, 2014. [PDF]

2. Zhang, N., Lin, C.-M., Senesky, D.G. and A. P. Pisano, "Temperature sensor based on 4H-silicon carbide pn diode operational from 20°C to 600°C," Applied Physics Letters, vol. 104, no. 7, 073504, 2014. [PDF]

3. Shankar, A., Lin, C. M., Angadi, C., Bhattacharya, S., Broad, N., and Senesky, D. G., "Impact of gamma irradiation on GaN/sapphire surface acoustic wave resonators", in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 2560-2563, Sep. 2014.

4. H. Kock, C. A. Chapin, C. Ostermaierd, O. Haberlend and D. G. Senesky, "Emerging GaN-based HEMTs for mechanical sensing within harsh environments", in Proc. SPIE 9113, Sensors for Extreme Harsh Environments, 91130D,2014.

5. A. Shankar, C. Angadi, S. Bhattacharya, C.-M. Lin, and D.G. Senesky, "Characterization of Irradiated and Temperature-compensated Gallium Nitride Surface Acoustic Wave Resonators," In Proc.SPIE, vol. 9113, pp. 91130B, 2014.

6. Chiamori, H.C., Angadi, C., Suria, A., Shankar, A., Hou, M., Bhattacharya, S., and Senesky, D.G., “Effects of radiation and temperature on gallium nitride (GaN) metal- semiconductor-metal ultraviolet photodetectors,” In Proc. of SPIE, vol. 9113, pp. 911304, 2014.

7. Hou, M., Pan, C-C., Asheghi, M. and Senesky, D.G., "Finite element thermal analysis of localized heating of AlGaN/GaN HEMT based sensors", in Proc. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014.

8. Chiamori, H.C., Hou, M., Chapin, C.A., Shankar, A., and Senesky, D.G., “Characterization of gallium nitride microsystems within radiation and high-temperature environments,” presented at SPIE MOEMS-MEMS, 2014.

2013

1. Maboudian, R., Carraro, C., Senesky, D.G. and C. Roper, "Advances in silicon carbide science and technology at the micro- and nanoscales," Journal of Vacuum Science & Technology A, vol. 31, no. 5, 050805, 2013. (Top 20 Most Downloaded, June and July 2013) [PDF]

2. Chapin, C.A., Chiamori, H.C., Hou, M., and D.G. Senesky, "Characterization of Gallium Nitride Heterostructures for Strain Sensing at Elevated Temperatures," In Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM, Stanford, CA, pp. 1621-1628, 2013.

3. Senesky, D.G., "Robust Sensors for Structural Health Monitoring within Harsh Environments," In Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM, Stanford, CA, pp. 45-50, 2013.

4. Angadi, C., Chiamori, H., Sundaramoorthy, P., Bhattacharya, S. and Senesky, D.G. , “Characterization of wide bandgap microsystems components for nano, pico & femto-satellite applications,” In Proc. of the International Astronautical Congress (IAC), pp. 1-9, Beijing, China, 2013.

5. Lai, Y.-J., Li, W.C. Lin, C.-M., Felmetsger, V.V., Senesky, D.G. and A.P. Pisano, "MEMS Piezoelectric Energy Harvesters for Harsh Environment Sensing," In Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM, Stanford, CA, pp. 2275-2282, 2013.

2012

1. Lin, C.-M., Chen, Y.-Y., Felmetsger, V.V., Senesky, D.G. and A. P. Pisano, "AlN/3C-SiC composite plate enabling high-frequency and high-Q micromechanical resonators," Advanced Materials, vol. 24, pp.2722–2727, 2012. (Selected for Frontispiece) [PDF]

2. Lin, C.-M., Chen, Y.-Y., Felmetsger, V.V., Vigevani, G., Senesky, D.G. and A.P. Pisano, "Micromachined aluminum nitride acoustic resonators with an epitaxial silicon carbide layer utilizing high-order Lamb wave modes," In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Paris, France, pp. 733-736, 2012.

Pre 2012

1. Lien, W.-C., Tsai, D.-S., Chiu, S.-H., Senesky, D.G., Maboudian, R., Pisano, A.P., and J.-H. He, “Low-Temperature, Ion Beam-Assisted SiC Thin Films With Antireflective ZnO Nanorod Arrays for High-Temperature Photodetection,” IEEE Electron Device Letters, vol. 32, pp. 1564 - 1566, Nov. 2011. [PDF]

2. Hsia, B., Ferralis, N., Senesky, D.G., Pisano, A.P., Carraro, C. and Maboudian, R., “Epitaxial Graphene Growth on 3C-SiC(111)/AlN(0001)/Si(100),” Electrochemical and Solid-State Letters, vol. 14, no. 2, pp. K13-K15, 2011. [PDF]

3. Lin, C.-M., Lai, Y.-J., Hsu, J.-C., Chen, Y.-Y., Senesky, D.G. and A.P. Pisano, "High-Q aluminum nitride Lamb wave resonators with biconvex edges," Applied Physics Letters, vol. 99, 143501, 2011. [PDF]

4. Wodin-Schwartz, S., Chan, M.W., Mansukhani, K., Pisano, A.P., and D.G. Senesky, “MEMS Sensors for Down-Hole Monitoring of Geothermal Energy Systems,” In Proceedings of the 5th International Conference on Energy Sustainability & 9th Fuel Cell Science, Washington, DC, 2011.

5. Lien, W.-C., Tsai, D.-S., Chiu, S.-H., Senesky, D.G., R. Maboudian, A.P. Pisano, and J.-H. He, “Nanocrystalline SiC Metal-Semiconductor-Metal Photodetector with ZnO Nanorod Arrays for High-Temperature Applications.” In Proceedings of the International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers, Beijing, China, pp. 1875-1878, 2011.

6. Lin, C.-M., Lai, Y.-J., Yen, T.-T., Hsu, J.-C., Chen, Y.-Y., Senesky, D.G., and A.P. Pisano, "Quality factor enhancement in Lamb wave resonators utilizing AlN plates with convex edges," In Proceedings of the International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers, Beijing, China, pp. 1512-1515, 2011.

7. Lin, C.-M., Lien, W.-C, Felmetsger, V., Hopcroft, M.A., Senesky, D.G. and A.P. Pisano, “AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices,” Applied Physics Letters, vol. 97, 141907, 2010. [PDF]

8. Lien, W.-C., Cheng, K.B., Senesky, D.G., Carraro, C., Pisano, A.P., and R. Maboudian, “Growth of 3C-SiC/AlN/Si(100) layered structure with atomically abrupt interface via modified precursor feeding procedure,” Electrochemical and Solid-State Letters, vol. 13, no. 7, pp. D53-D56, 2010. [PDF]

9. Lai, Y.J., Senesky, D.G. and A.P. Pisano, “Genetic Algorithm Optimization for MEMS Cantilevered Piezoelectric Energy Harvesters,” In Proceedings of the International Workshop on Power MEMS, Leuven, Belgium, 2010.

10. Wodin-Schwartz, S., Hopcroft, M.A., Senesky, D.G. and A.P. Pisano “MEMS Sensing in an In-Cylinder Combustion Environment, In Proceedings of the International Workshop on Power MEMS, Leuven, Belgium, 2010.

11. Liu, F., Hsia, B., Senesky, D.G., Carraro, C., Pisano, A.P., and R. Maboudian, “Ohmic Contact With Enhanced Stability to Polycrystalline Silicon Carbide Via Carbon Interfacial Layer,” In Proceedings of the Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, South Carolina, 2010.

12. Lin, C.-M., Lien, W.-C, Felmetsger, V., Senesky, D.G., Hopcroft, M.A. and A.P. Pisano, “Growth of Highly C-Axis Oriented AlN Films on 3C-SiC/Si Substrate,” In Proceedings of the Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, South Carolina, 2010.

13. Senesky, D.G., and A.P. Pisano, “Aluminum Nitride as a Masking Material for the Plasma Etching of Silicon Carbide Structures,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Hong Kong, 2010.

14. Yen, T.-T., Lin, C.M., Zhao, X., Senesky, D.G., Hopcroft, M.A., and A.P. Pisano, “Characterization of Aluminum Nitride Lamb Wave Resonators Operating At 600°C For Harsh Environment RF Applications,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Hong Kong, 2010.

15. Lin, C.-M., Chen, Y.Y., Felmetsger, V.V., Yen, T.-T., Lien, W.-C., Senesky, D.G., and A.P. Pisano, "Surface acoustic wave propagation properties in AlN/3C-SiC/Si composite structure," In Proceedings of the IEEE International Ultrasonics Symposium, San Diego, CA, pp. 1696-1699, Oct. 2010.

16. Yen, T-.T., C.-M. Lin, C.-M., Hoprcoft, M.A. Kuypers, J.H., Senesky, D.G., and A. P. Pisano, "Synthesis of narrowband AlN Lamb wave ladder-type filters based on overhang adjustment," In Proceedings of the IEEE International Ultrasonics Symposium, San Diego, CA, pp. 970-973, Oct. 2010.

17. Senesky, D.G., Jamshidi, B., Cheng, K. B., and A.P. Pisano, “Harsh Environment Silicon Carbide Sensors for Health and Performance Monitoring of Aerospace Systems: a Review,” IEEE Sensors Journal, vol. 9, no. 11, pp. 1472-1478, 2009. [PDF]

18. Myers, D.R., Cheng, K.B., Jamshidi, B., Azevedo, R.G., Senesky, D.G., Chen, L., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A Silicon Carbide Resonant Tuning Fork for Micro-Sensing Applications in High Temperature and High G-Shock Environments,” Journal of Micro/Nanolithography, MEMS, and MOEMS, vol.8, no.2, 021116, 2009. [PDF]

19. Lien, W.C., Cheng, K.B., Senesky, D.G., Carraro, C., Pisano, A.P., and R. Maboudian “Epitaxial Growth of 3C-SiC on AlN/Si (100) via Methyltrichlorosilane-based Chemical Vapor Deposition” In Proceedings of the International Workshop on 3C-SiC Hetero-epitaxy, Catania, Italy, 2009.

20. Park, S.W., Senesky, D.G., and A.P. Pisano, “Electrodeposition of Permalloy in Deep Silicon Trenches without Edge-Overgrowth Utilizing Dry Film Photoresist,” In Proceedings of the IEEE I nternational Conference on Micro Electro Mechanical Systems, IEEE MEMS, Sorrento, Italy, 2009.

21. K. B. Cheng, D. R. Myers, B. Jamshidi, R. G. Azevedo, Jones (aka Senesky), D.G., M. Mehregany, M. B. J. Wijesundara, and A. P. Pisano, “High Resolution Silicon Carbide Strain Gauge at 600oC,” In Proceedings of Asia-Pacific Conference on Transducers and Micro-Nano Technology, APCOT, 2008.

22. Azevedo, R.G., Jones (aka Senesky), D.G., Jog, A.V., Jamshidi, B., Myers, D.R., Chen, L., Fu, X., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications,” IEEE Sensors Journal, vol. 7, no. 4, pp. 568-576, 2007. [PDF]

23. D. G. Jones (aka Senesky), and A.P. Pisano, “Ion Beam Sputter Deposition of Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the MicroElectronics Packaging & Test Engineering Council (MEPTEC) MEMS Symposium, San Jose, California, 2007.

24. Azevedo, R. G., Zhang, J., Jones (aka Senesky), D.G., Myers, D. R., Jog, A.V., Jamshidi, B., Wijesundara, M.B.J., Maboudian, R., and A.P. Pisano, “Silicon Carbide Coated MEMS Strain Sensor for Harsh Environment Applications, In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

25. Jones (aka Senesky), D.G., Azevedo, R. G., Chan, M. W., Pisano, A. P., and M. B. J. Wijesundara, “Low Temperature Ion Beam Sputter Deposition of Amorphous Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

26. Jones (aka Senesky), D.G., and A.P. Pisano, “Fabrication of Ultra Thick Ferromagnetic Structures in Silicon,” In Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE, Anaheim, California, 2004.

27. Fernandez-Pello, A. C., Pisano, A. P., Fu, K., Walther, D., Knobloch, A., Martinez, F., Senesky, M., Jones (aka Senesky), D.G., Stoldt, C., and J. Heppner, “MEMS Rotary Engine Power System,” In Proceedings of the International Workshop on Power MEMS, Tsukuba, Japan, 2002.

Book Chapters

1. Senesky, D.G. and B. Jamshidi, MEMS Strain Sensors for Intelligent Structural Systems. In S. Mukhopadhyay (Ed.), New Developments in Sensing Technology for Structural Health Monitoring, Springer-Verlag, pp. 63-74, 2011.

Technical Reports

1. Essigmann, M., Shankar, A., and Senesky, D.G., “Smart-Cut Processing for Transfer of High-Temperature Ceramic Materials to Silicon,” NNIN REU Technical Report, 2015. [PDF]

2. Huang, T., Suria, A.J., Suria, and Senesky, D.G., “Deposition of the Immobilization Layer on Gallium Nitride for Extremophile-Based Biosensors,” NNIN REU Technical Report, 2013. [PDF]

3. Senesky, D.G., Lee, E., and S. Selkowitz, “Active Materials for New Energy Efficient Window Glazing Technology: Feasibility Study,” Technical Report for Lawrence Berkeley National Laboratory and Department of Energy, 2011.